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Treasury & Capital Markets
Cash management and payment innovation forum set in Shanghai
Preparations are underway for the 2014 Cash Management and Payment Innovation Forum co-hosted by Shanghai University of Finance and Economics (SUFE) business college and Golden Finance, scheduled on October 30-31.
The Asset 8 Oct 2014
Preparations are underway for the 2014 Cash Management and Payment Innovation Forum co-hosted by Shanghai University of Finance and Economics (SUFE) business college and Golden Finance, scheduled on October 30-31. Supported by government organizations, banks, professional services groups and research institutes, the forum offers a platform for the corporate treasury and e-commerce companies to practice and enhance treasury management.
 
With "Brainstorming of renminbi internationalization, building a new payment structure" as the theme, the forum will gather decision makers from regulatory agencies, enterprises, banks and third party payment companies to draw up an outline of the global competitive landscape, discussing China’s financial reform and Shanghai Free-Trade Zone, resolving cross-border payments and third-party payment innovative solutions, among others.
 
Companies joining the forum are CNOOC, CNBM, Siemens Financial Services, IFC, Microsoft Asia-Pacific, Kohler Asia-Pacific, SMIC, International Paper Asia-Pacific, Guotai Junan Securities, Youku, Tudou Inc, and Alibaba. Over 400 delegates are expected to attend the two-day event.

    

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